▼Job Responsibilities
【Semiconductor Manufacturing Equipment Assembly】
You will be assembling equipment used for manufacturing semiconductor products.There is a workplace tour available beforehand, so you can start your job with ease.
The specific duties are as follows:
- Precisely assembling parts of semiconductor manufacturing equipment
- Following instructions to use tools for connecting parts
- Checking and confirming the operation of the completed equipment
- Cleaning and organizing the workplace environment as needed
▼Salary
Hourly wage: 1,250-1,563 yen
Example of monthly income: 210,000 yen per month (based on an 8-hour workday, 21 days of operation)
Overtime work is paid separately
Advance pay system for salary is available
Daily payment is also available (with stipulations)
▼Contract Period
Without a fixed contract period
▼Working Days and Hours
[Work Hours]
8:30 to 17:30 (8 hours of actual work)
[Break Time]
1 hour
Implied breaks in the morning and afternoon of 10 minutes each
[Minimum Work Hours]
8 hours
[Minimum Number of Work Days]
5 days
▼Overtime Details
None
▼Holiday
Saturdays, Sundays, and national holidays are days off. According to the company calendar, there are various long holidays.
▼Training
None
▼Company Location
Hibiya Park Front Bldg, 2-1-6, Uchi-saiwai-cho, Chiyoda-ku, Tokyo
▼Work Location
Location: Taiwa-machi, Kurokawa-gun, Miyagi
Nearest station: Izumi-chuo Station (about 15 minutes by car (about 6.7 km))
▼Available Insurance
Social insurance provided
▼Benefit
- Resume not required
- Complete social insurance coverage
- Transportation expenses paid
- Advance payment system available
- Daily payment OK (with regulations)
- Car commuting possible (free parking)
▼Smoking Information
None in particular